PCB solder mask common problems and circuit board solder mask screen printing machine solutions

The PCB circuit board solder mask process is one of the key links in the PCB manufacturing process, and its quality issues have an important impact on the performance and reliability of the PCB. In the solder mask process, common quality problems include pores, false soldering, and leakage. These problems may not only lead to reduced PCB performance and reliability, but may also bring unnecessary losses to production. This article will introduce practical methods to solve these problems and explore the application of PCB solder mask screen printing machines in solving these problems.

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1. Explanation of common quality problems in PCB solder mask process

 

1. Stomata

Porosity is one of the common quality problems in the PCB solder mask process. It is mainly caused by the insufficient exhaustion of gas in the solder mask material. These pores will cause problems such as poor electrical performance and short circuits in the PCB during subsequent processing and use.

 

2. Virtual soldering

Welding refers to poor contact between the PCB pads and components, resulting in unstable electrical performance and easy short circuit or open circuit. Virtual soldering is mainly caused by insufficient adhesion between the solder mask material and the pad or improper process parameters.

 

3. Leakage

Leakage is when there is current leakage between different circuits on a PCB or between a circuit and a grounded part. Leakage will not only affect the performance of the circuit, but may also cause safety issues. Reasons for leakage may include quality issues with solder mask materials, improper process parameters, etc.

 

2. Solution

 

To address the above quality issues, the following solutions can be taken:

 

For the problem of pores, the coating process of the solder resist material can be optimized to ensure that the material fully penetrates between the lines, and a pre-baking process can be added to fully discharge the gas in the solder resist material. In addition, you can also add a scraper pressure adjustment after screen printing to help eliminate pores. Here we recommend that you learn about the intelligent fully automatic solder mask hole plugging machine with its own pressurization system. With 6~8 kg of gas, it can achieve The scraper can fill the hole with one stroke and fully discharge the gas. There is no need to rework the plug hole repeatedly. It is efficient, saves time and trouble, and greatly reduces the scrap rate.

 

For the problem of virtual soldering, the process can be optimized to ensure sufficient adhesion between the solder mask material and the pad. At the same time, in terms of process parameters, the baking temperature and pressure can be appropriately increased to improve the adhesion between the solder resist material and the pad.

 

For leakage problems, the quality control of solder resist materials can be strengthened to ensure stable electrical performance. At the same time, in terms of process parameters, the baking temperature and time can be appropriately increased to fully solidify the solder resist material, thereby improving the insulation performance of the circuit.

 

3. Application of Xinjinhui PCB circuit board solder mask printing machine

 

In response to the above quality problems, Xinjinhui PCB solder mask can provide effective solutions. The equipment adopts advanced screen printing technology, which can accurately control the coating amount and position of solder mask material, effectively avoiding the occurrence of pores and false soldering. At the same time, the equipment also has an intelligent process control function, which can quickly switch material numbers in 3 to 5 minutes without the need for handwheel adjustment and integrates a fully intelligent alignment system to ensure that solder mask screen printing is accurate and efficient.

 

Practice has proven that the use of Xinjinhui PCB circuit board solder mask screen printing machine can effectively improve the quality and production efficiency of the PCB solder mask process. The application of this equipment can not only reduce the production of defective products and improve production efficiency, but also provide customers with high-quality PCB products to meet various application needs.

 

4. Summary

 

This article introduces common quality problems and solutions in the PCB solder mask process, focusing on the application of Xinjinhui PCB circuit board solder mask screen printing machine in solving these problems. Practice has shown that the use of solder resist can effectively improve the quality and production efficiency of the PCB solder resist process, reduce the occurrence of defective products, and improve production efficiency. At the same time, this equipment can also provide customers with high-quality PCB products to meet various application needs. The solutions and methods described by Xin Jinhui in this article can provide certain reference and guidance for relevant enterprises.

 


Post time: Mar-20-2024